Patent Assignment
Reel/Frame 037364/0174
Assignment of Assignor's Interest
Recorded: 2015-12-28
Pages: 4
Assignors
HSIEH, CHENG-HSIEN
Executed: 2015-11-27
WU, CHI-HSI
Executed: 2015-12-09
YU, CHEN-HUA
Executed: 2015-12-09
YEH, DER-CHYANG
Executed: 2015-12-09
CHEN, HSIEN-WEI
Executed: 2015-11-27
HSU, LI-HAN
Executed: 2015-11-27
WU, WEI-CHENG
Executed: 2015-11-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Opening in the Pad for Bonding Integrated Passive Device in InFO Package