Patent Assignment
Reel/Frame 037373/0094
Assignment of Assignor's Interest
Recorded: 2015-12-29
Pages: 3
Assignor
SIEMENS CORPORATION
Executed: 2015-12-17
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, MUNICH, 80333, GERMANY
Covered Property
(1)
Ball Grid Array Modeling for Inspecting Surface Mounted Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.