Patent Assignment
Reel/Frame 037397/0622
Assignment of Assignor's Interest
Recorded: 2015-12-29
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Bonding Structure and Flexible Device
Patent:
9,607,960 →
Application:
14/983,506 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.