IP Library › Assignment 037435/0954
Patent Assignment
Reel/Frame 037435/0954

Assignment of Assignor's Interest

Recorded: 2016-01-08 Pages: 8
Assignors
EDWARDS, WILLIAM E.
Executed: 2014-02-14
JOHNSON, GARY C.
Executed: 2014-02-24
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Multiple Die Lead Frame Packaging
Patent: 9,397,082 →
Application: 14/990,468 →
Publication: US 2016/0118373
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Merger Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name. Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →