Patent Assignment
Reel/Frame 037454/0164
Assignment of Assignor's Interest
Recorded: 2016-01-11
Pages: 2
Assignor
PROMERUS, LLC
Executed: 2016-01-08
Assignee
SUMITOMO BAKELITE CO., LTD.
TENNOZ PARKSIDE BUILDING, 5-8 HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, 140-0002, JAPAN
Covered Property
(1)
Methods and Materials Useful for Chip Stacking, Chip and Wafer Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.