IP Library Assignment 037478/0084
Patent Assignment
Reel/Frame 037478/0084

Assignment of Assignor's Interest

Recorded: 2016-01-13 Pages: 4
Assignors
MAPLE, MARSHALL
Executed: 2016-01-11
ALAWANI, ASHISH
Executed: 2016-01-06
SUN, LI
Executed: 2016-01-06
HANEY, SARAH
Executed: 2016-01-06
LEE, LEA-TENG
Executed: 2016-01-06
YAO, WEI
Executed: 2016-01-06
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Via Structures for Thermal Dissipation
Application: 14/929,309 →
Publication: US 2017/0018501
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →