IP Library Assignment 037495/0331
Patent Assignment
Reel/Frame 037495/0331

Assignment of Assignor's Interest

Recorded: 2016-01-14 Pages: 3
Assignors
OTSUKA, MASAKI
Executed: 2015-12-25
IWASAWA, KOKI
Executed: 2015-12-25
SUGATA, SHIGEYA
Executed: 2015-12-25
OTSUKA, YOSHITAKA
Executed: 2015-12-25
Assignee
OLYMPUS CORPORATION
43-2, HATAGAYA 2-CHOME, SHIBUYA-KU, TOKYO, 151-0072, JAPAN
Covered Property (1)
Injection Molding Method and Injection Molding Die
Application: 14/996,044 →
Publication: US 2016/0129649
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 15, 2017
From: OLYMPUS CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 042821/0621 →