Patent Assignment
Reel/Frame 037547/0255
Assignment of Assignor's Interest
Recorded: 2016-01-21
Pages: 6
Assignors
TAKAMOTO, NAOHIDE
Executed: 2016-01-05
HANAZONO, HIROYUKI
Executed: 2016-01-05
FUKUI, AKIHIRO
Executed: 2016-01-05
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Dicing-Tape Integrated Film for Backside of Semiconductor and Method of Manufacturing Semiconductor Device