Patent Assignment
Reel/Frame 037559/0289
Assignment of Assignor's Interest
Recorded: 2016-01-22
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-12-10
YEE, KUO-CHUNG
Executed: 2015-12-10
TSAI, HAO-YI
Executed: 2015-12-15
KUO, TIN-HAO
Executed: 2015-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connectors