IP Library Assignment 037800/0416
Patent Assignment
Reel/Frame 037800/0416

Assignment of Assignor's Interest

Recorded: 2016-02-23 Pages: 3
Assignors
HIOKA, TAKAAKI
Executed: 2016-02-19
EBIHARA, MIKA
Executed: 2016-02-19
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property (1)
Magnetic Sensor Having a Recessed Die Pad
Patent: 9,741,924 →
Application: 15/050,827 →
Publication: US 2016/0254441
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
Change of Address Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →