Patent Assignment
Reel/Frame 037811/0926
Assignment of Assignor's Interest
Recorded: 2016-02-24
Pages: 3
Assignors
KOBAYASHI, WATARU
Executed: 2016-02-15
HAYASHI, EIJI
Executed: 2016-02-15
KOUDA, KAZUKI
Executed: 2016-02-15
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Metal Member, Metal Member Surface Processing Method, Semiconductor Device, Semiconductor Device Manufacturing Method, and Composite Molded Body