Patent Assignment
Reel/Frame 037828/0962
Assignment of Assignor's Interest
Recorded: 2016-02-25
Pages: 3
Assignor
KIMURA, NORIYUKI
Executed: 2016-02-19
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Resin-Encapsulated Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.