Patent Assignment
Reel/Frame 037831/0918
Assignment of Assignor's Interest
Recorded: 2016-02-25
Pages: 4
Assignors
LIN, WEN-YI
Executed: 2016-02-18
LIU, HSIEN-WEN
Executed: 2016-02-18
LIN, PO-YAO
Executed: 2016-02-18
HUANG, CHENG-LIN
Executed: 2016-02-18
LEU, SHYUE-TER
Executed: 2016-02-17
JENG, SHIN-PUU
Executed: 2016-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package on Package Structure and Methods of Forming Same