Patent Assignment
Reel/Frame 037841/0553
Assignment of Assignor's Interest
Recorded: 2016-02-26
Pages: 3
Assignors
LEE, SUNG-YOUNG
Executed: 2016-02-25
KANG, TAE-HWAN
Executed: 2016-02-25
CHUN, JUNG-HO
Executed: 2016-02-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Having Through-Hole Formed Therein