IP Library › Assignment 037843/0535
Patent Assignment
Reel/Frame 037843/0535

Assignment of Assignor's Interest

Recorded: 2016-02-26 Pages: 7
Assignors
CHINNUSAMY, SATYAMOORTHI
Executed: 2016-02-12
SIMPSON, KEVIN
Executed: 2016-02-26
COSTELLO, MARK C.
Executed: 2016-02-11
Assignee
SEMTECH CORPORATION
200 FLYNN ROAD, CAMARILLO, CALIFORNIA, 93012
Covered Property (1)
Semiconductor Device and Method of Forming Insulating Layers Around Semiconductor Die
Patent: 9,837,375 →
Application: 15/055,264 →
Publication: US 2017/0250158
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 15, 2016
From: SEMTECH CORPORATION
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039170/0082 →
Security Interest Nov 17, 2016
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 040646/0799 →
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (040646/0799) Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0544 →