Patent Assignment
Reel/Frame 037853/0075
Assignment of Assignor's Interest
Recorded: 2016-02-29
Pages: 3
Assignor
ORIMOTO, NORIMUNE
Executed: 2016-01-28
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property
(1)
Semiconductor Device Having Semiconductor Elements Connected to an Intermediate Plate by a Brazing Filler Metal, and Manufacturing Method for Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.