Patent Assignment
Reel/Frame 037874/0808
Assignment of Assignor's Interest
Recorded: 2016-03-02
Pages: 3
Assignor
HIKICHI, TOMOKI
Executed: 2016-02-09
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Sensor Device and Inspection Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.