Assignment of Assignor's Interest

Recorded: 2016-03-03 Pages: 4

Assignors

YOKOKAWA, ISAO

Executed: 2016-01-13

AGA, HIROJI

Executed: 2016-01-13

FUJISAWA, HIROSHI

Executed: 2016-01-13

Assignee

SHIN-ETSU HANDOTAI CO., LTD.

2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Method for Manufacturing Bonded Wafer

Patent: 9,865,497 →

Application: 14/916,289 →

Publication: US 2016/0197008

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.