IP Library Assignment 037884/0019
Patent Assignment
Reel/Frame 037884/0019

Assignment of Assignor's Interest

Recorded: 2016-03-03 Pages: 2
Assignor
FURUTA, NAOMASA
Executed: 2016-02-05
Assignee
TOAGOSEI CO., LTD.
1-14-1, NISHI-SHIMBASHI, MINATO-KU, TOKYO, 105-8419, JAPAN
Covered Property (1)
Organosilicon Compound-Containing Thermosetting Composition and Cured Product Thereof
Patent: 9,663,598 →
Application: 14/916,321 →
Publication: US 2016/0200842