IP Library Assignment 037893/0094
Patent Assignment
Reel/Frame 037893/0094

Assignment of Assignor's Interest

Recorded: 2016-03-04 Pages: 3
Assignors
KASAI, WATARU
Executed: 2016-01-25
SUZUKI, MASAMI
Executed: 2016-01-25
Assignee
ASAHI GLASS COMPANY, LIMITED
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Property (1)
Mold Release Film and Process for Producing Semiconductor Package
Patent: 9,859,133 →
Application: 15/061,044 →
Publication: US 2016/0189985
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →