IP Library Assignment 037934/0804
Patent Assignment
Reel/Frame 037934/0804

Assignment of Assignor's Interest

Recorded: 2016-03-09 Pages: 6
Assignors
WEST, PETER
Executed: 2016-03-09
KOSIER, STEVEN
Executed: 2016-03-08
KAMIMURA, TATSUYA
Executed: 2016-03-09
RANKILA, DON
Executed: 2016-03-09
Assignees
POLAR SEMICONDUCTOR, LLC
2800 E OLD SHAKOPEE RD., BLOOMINGTON, MINNESOTA, 55425
SANKEN ELECTRIC CO., LTD.
6-3, KITANO 3-CHROME,, NIIZA-SHI, SAITAMA, JAPAN
Covered Property (1)
High Voltage Tolerant Bonding Pad Structure for Trench-Based Semiconductor Devices
Patent: 9,899,343 →
Application: 15/065,227 →
Publication: US 2017/0263580
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Oct 7, 2024
From: POLAR SEMICONDUCTOR, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 069114/0336 →