Patent Assignment
Reel/Frame 037963/0998
Assignment of Assignor's Interest
Recorded: 2016-03-14
Pages: 2
Assignors
LIU, YU-CHIA
Executed: 2016-03-07
CHU, CHIA-HUA
Executed: 2016-03-07
CHENG, CHUN-WEN
Executed: 2016-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Structure for CMOS-MEMS Thin Film Encapsulation