Patent Assignment
Reel/Frame 038002/0642
Assignment of Assignor's Interest
Recorded: 2016-03-16
Pages: 5
Assignors
KOMO, HIDEO
Executed: 2016-02-02
OMARU, TAKESHI
Executed: 2016-02-02
SAITO, SHOJI
Executed: 2016-02-02
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 1008310, JAPAN
Covered Property
(1)
Semiconductor Device Module with Solder Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.