Patent Assignment
Reel/Frame 038084/0072
Assignment of Assignor's Interest
Recorded: 2016-03-23
Pages: 2
Assignor
TOPAK, ALI ERAY
Executed: 2015-12-11
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Package with Embedded Electronic Components and a Waveguide Cavity through the Package Cover, Antenna Apparatus including Package, and Method of Manufacturing the Same