Patent Assignment
Reel/Frame 038087/0316
Assignment of Assignor's Interest
Recorded: 2016-03-24
Pages: 3
Assignor
BAEK, YONG-HO
Executed: 2016-03-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
15/079,074 →
Publication:
US 2016/0372411