Patent Assignment
Reel/Frame 038196/0854
Assignment of Assignor's Interest
Recorded: 2016-04-05
Received: 2016-04-05
Pages: 9
Assignors
CHAI, SEUNGYONG
Executed: 2016-03-31
CHO, SUNGWON
Executed: 2016-03-31
HAN, BYUNG JOON
Executed: 2016-03-31
KIM, SUNGSOO
Executed: 2016-03-31
KOO, KYOWANG
Executed: 2016-03-31
LEE, HUN TEAK
Executed: 2016-03-31
LIN, YAOJIAN
Executed: 2016-03-31
PARK, KYOUNGHEE
Executed: 2016-03-31
SHIM, IL KWON
Executed: 2016-03-31
YANG, DEOKKYUNG
Executed: 2016-03-31
YOON, IN SANG
Executed: 2016-03-31
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Shielding and Method of Manufacture Thereof
Application:
15/091,049 →
Integrated Circuit Packaging System with Electromagnetic Interference Shielding and Method of Manufacture Therefor
Application:
62/146,209 →