Patent Assignment
Reel/Frame 038232/0633
Assignment of Assignor's Interest
Recorded: 2016-04-08
Pages: 3
Assignor
NAKANO, MASAHIRO
Executed: 2002-11-13
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Package Substrate, Integrated Circuit Apparatus, Substrate Unit, Surface Acoustic Wave Apparatus, and Circuit Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.