Patent Assignment
Reel/Frame 038341/0115
Assignment of Assignor's Interest
Recorded: 2016-04-04
Pages: 2
Assignor
LEE, HYUN-BAE
Executed: 2016-03-16
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Semiconductor Package