Patent Assignment
Reel/Frame 038356/0459
Assignment of Assignor's Interest
Recorded: 2016-04-22
Pages: 3
Assignor
LEE, SUNG CHUL
Executed: 2016-04-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Resin Composition for Packaging and Printed Circuit Board Using the Same