Patent Assignment
Reel/Frame 038376/0416
Assignment of Assignor's Interest
Recorded: 2016-04-25
Pages: 8
Assignee
YAZAKI CORPORATION
4-28, MITA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Heat Dissipation Structure for Connector Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.