Patent Assignment
Reel/Frame 038435/0082
Assignment of Assignor's Interest
Recorded: 2016-05-02
Pages: 11
Assignors
CHEN, MENG-TSE
Executed: 2016-04-12
LIU, YU-CHIH
Executed: 2016-04-25
HUANG, HUI-MIN
Executed: 2016-04-12
LIN, WEI-HUNG
Executed: 2016-04-12
LU, JING RUEI
Executed: 2016-04-14
CHENG, MING-DA
Executed: 2016-04-12
LIU, CHUNG-SHI
Executed: 2016-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package-On-Package Structure Having Polymer-Based Material for Warpage Control