Patent Assignment
Reel/Frame 038452/0603
Assignment of Assignor's Interest
Recorded: 2016-05-04
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Devices, Packaged Semiconductor Devices, and Semiconductor Device Packaging Methods