Patent Assignment
Reel/Frame 038482/0614
Assignment of Assignor's Interest
Recorded: 2016-05-05
Pages: 4
Assignors
WU, CHUNG-WEN
Executed: 2016-04-08
JANGJIAN, SHIU-KO
Executed: 2016-04-08
CHIU, CHIEN-WEN
Executed: 2016-04-08
CHEN, CHIEN-CHUNG
Executed: 2016-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Interconnection Structure and Manufacturing Method Thereof