Patent Assignment
Reel/Frame 038717/0154
Assignment of Assignor's Interest
Recorded: 2016-05-25
Pages: 7
Assignors
LEE, KYU-HA
Executed: 2016-02-11
JEON, HYUNG-JUN
Executed: 2016-02-16
PARK, JUM-YONG
Executed: 2016-02-11
PARK, BYUNG-LYUL
Executed: 2016-02-16
PARK, JI-SOON
Executed: 2016-02-14
AN, JIN-HO
Executed: 2016-02-11
CHUN, JIN-HO
Executed: 2016-02-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing the Same, and Semiconductor Packages Including the Semiconductor Devices