Patent Assignment
Reel/Frame 038762/0187
Assignment of Assignor's Interest
Recorded: 2016-06-01
Pages: 8
Assignors
YANG, TAI-I
Executed: 2013-12-18
CHUANG, CHENG-CHI
Executed: 2013-12-18
WANG, YUNG-CHIH
Executed: 2013-12-18
LIN, TIEN-LU
Executed: 2013-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Air-Gap Forming Techniques for Interconnect Structures