Patent Assignment
Reel/Frame 038764/0981
Assignment of Assignor's Interest
Recorded: 2016-06-01
Pages: 3
Assignee
FUJI MACHINE MFG. CO., LTD.
19, CHAUSUYAMA, YAMAMACHI, CHIRYU, AICHI, 472-8686, JAPAN
Covered Property
(1)
Solder Supply Device Including a Solder Cup and a Nozzle Section with a Flange Section That Is Elastically Deformable
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.