Patent Assignment
Reel/Frame 038787/0827
Assignment of Assignor's Interest
Recorded: 2016-06-02
Pages: 3
Assignor
MATSUURA, HITOSHI
Executed: 2016-04-19
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device with Contact Groove Arrangements Providing Improved Performance