IP Library › Assignment 038799/0126
Patent Assignment
Reel/Frame 038799/0126

Assignment of Assignor's Interest

Recorded: 2016-05-24 Pages: 3
Assignor
BULTITUDE, JOHN
Executed: 2014-02-27
Assignee
KEMET ELECTRONICS CORPORATION
200 N. MAIN STREET, SIMPSONVILLE, SOUTH CAROLINA, 29681
Covered Property (1)
Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metallurgical Bond
Patent: 9,793,057 →
Application: 15/149,309 →
Publication: US 2016/0254097
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 9, 2016
From: MCCONNELL, JOHN E.; RENNER, GARRY L.
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 038640/0382 →
Security Agreement May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
Release of Security Interest Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →