Patent Assignment
Reel/Frame 038799/0943
Assignment of Assignor's Interest
Recorded: 2016-06-03
Pages: 9
Assignors
VUKKADALA, PRADEEP
Executed: 2013-01-02
VEERARAGHAVAN, SATHISH
Executed: 2013-01-02
SINHA, JAYDEEP
Executed: 2013-01-02
CHEN, HAIGUANG
Executed: 2013-01-02
KIRK, MICHAEL
Executed: 2013-01-03
Assignee
KLA-TENCOR CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
System and Method to Emulate Finite Element Model Based Prediction of In-Plane Distortions Due to Semiconductor Wafer Chucking