Patent Assignment
Reel/Frame 038820/0206
Assignment of Assignor's Interest
Recorded: 2016-06-06
Pages: 6
Assignors
CHANG, GUN-HO
Executed: 2016-03-07
CHO, TAE-JE
Executed: 2016-03-07
SHIM, JONG-BO
Executed: 2016-03-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof