Assignment of Assignor's Interest

Recorded: 2016-05-27 Pages: 3

Assignors

KIM, JONG HOON

Executed: 2016-04-29

SUNG, KI JUN

Executed: 2016-04-29

YOO, YOUNG GEUN

Executed: 2016-04-29

CHOI, HYEONG SEOK

Executed: 2016-04-29

Assignee

SK HYNIX INC.

2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Manufacturing Methods Semiconductor Packages Including Through Mold Connectors

Patent: 9,659,910 →

Application: 15/167,383 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.