Patent Assignment
Reel/Frame 038994/0353
Assignment of Assignor's Interest
Recorded: 2016-06-23
Pages: 4
Assignor
KIM, YOUNG-IL
Executed: 2016-05-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Multiple Path Configuration for Power Supply Power of Semiconductor Chip Modules