Patent Assignment
Reel/Frame 039100/0478
Assignment of Assignor's Interest
Recorded: 2016-07-07
Pages: 4
Assignors
LEE, SEUNG-SEOB
Executed: 2016-06-16
KWON, HYUK-JOON
Executed: 2016-06-16
LIM, BO-TAK
Executed: 2016-06-16
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Three-Dimensional Crack Detection Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.