Patent Assignment
Reel/Frame 039112/0161
Assignment of Assignor's Interest
Recorded: 2016-07-08
Pages: 5
Assignors
ZHAO, SAM ZIQUN
Executed: 2016-07-06
LAW, EDWARD
Executed: 2016-07-06
VORENKAMP, PIETER
Executed: 2016-07-08
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
Thin Recon Interposer Package Without TSV for Fine Input/Output Pitch Fan-Out
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 24, 2016
From: ZHAO, SAM ZIQUN; KARIKALAN, SAM KOMARAPALAYAM; LAW, EDWARD; KHAN, REZAUR RAHMAN
To: BROADCOM CORPORATION
Reel/Frame 039530/0967 →
Assignment of Assignor's Interest
Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Merger
Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →