Patent Assignment
Reel/Frame 039144/0707
Assignment of Assignor's Interest
Recorded: 2016-07-13
Pages: 6
Assignors
KIM, KEUNG BEUM
Executed: 2016-05-02
MOON, HYUNJONG
Executed: 2016-05-02
LEE, HEESEOK
Executed: 2016-05-02
CHA, SEUNG-YONG
Executed: 2016-05-02
Assignee
SAMSUNG ELECTRONICS CO.,LTD.
129, SAMSUNG-RO,YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device for Improving Signal Integrity Issue in Center Pad Type of Stacked Chip Structure