Patent Assignment
Reel/Frame 039168/0368
Assignment of Assignor's Interest
Recorded: 2016-07-15
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2016-04-19
YEE, KUO-CHUNG
Executed: 2016-04-19
TSAI, HAO-YI
Executed: 2016-04-21
KUO, TIN-HAO
Executed: 2016-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process