Patent Assignment
Reel/Frame 039174/0322
Assignment of Assignor's Interest
Recorded: 2016-07-18
Pages: 3
Assignor
LEE, YA-LIEN
Executed: 2014-02-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Using a Barrier-Seed Tool for Forming Fine Pitched Metal Interconnects