Patent Assignment
Reel/Frame 039210/0054
Assignment of Assignor's Interest
Recorded: 2016-07-21
Pages: 4
Assignors
MENG, HSIEN-LIANG
Executed: 2016-07-14
LIN, WEI-HUNG
Executed: 2016-06-27
LIANG, YU-MIN
Executed: 2016-07-11
HO, MING-CHE
Executed: 2016-06-27
KUO, HUNG-JUI
Executed: 2016-06-27
LIU, CHUNG-SHI
Executed: 2016-06-27
LII, MIRNG-JI
Executed: 2016-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Methods for Forming the Same