Assignment of Assignor's Interest

Recorded: 2016-07-25 Pages: 3

Assignors

LIU, KAI

Executed: 2016-07-22

LIN, YAOJIAN

Executed: 2016-07-20

Assignee

STATS CHIPPAC PTE. LTD.

10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Antenna In Embedded Wafer-Level Ball-Grid Array Package

Patent: 9,806,040 →

Application: 15/219,098 →

Publication: US 2017/0033062