Patent Assignment
Reel/Frame 039276/0126
Assignment of Assignor's Interest
Recorded: 2016-07-06
Pages: 3
Assignors
CHENG, WEI-YUAN
Executed: 2016-06-28
TSAI, CHEN-CHU
Executed: 2016-06-28
LEE, YUH-ZHENG
Executed: 2016-06-28
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Electronic Device Package, Electronic Device Structure and Method of Fabricating Electronic Device Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 24, 2016
From: CHENG, WEI-YUAN; TSAI, CHEN-CHU; LEE, YUH-ZHENG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 039450/0913 →
Assignment of Assignor's Interest
Mar 15, 2022
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 059365/0305 →